Summary
Further key aspects of the report indicate that:
Chapter 1: Research Scope: Product Definition, Type, End-Use & Methodology
Chapter 2: Global Industry Summary
Chapter 3: Market Dynamics
Chapter 4: Global Market Segmentation by region, type and End-Use
Chapter 5: North America Market Segmentation by region, type and End-Use
Chapter 6: Europe Market Segmentation by region, type and End-Use
Chapter 7: Asia-Pacific Market Segmentation by region, type and End-Use
Chapter 8: South America Market Segmentation by region, type and End-Use
Chapter 9: Middle East and Africa Market Segmentation by region, type and End-Use.
Chapter 10: Market Competition by Companies
Chapter 11: Market forecast and environment forecast.
Chapter 12: Industry Summary.
The global Ball Grid Array (BGA) Packages market has the potential to grow with xx million USD with growing CAGR in the forecast period from 2021f to 2026f. Factors driving the market for @@@@@ are the significant development of demand and improvement of COVID-19 and geo-economics.
Based on the type of product, the global Ball Grid Array (BGA) Packages market segmented into
Molded Array Process BGA
Thermally Enhanced BGA
Package on Package (PoP) BGA
Micro BGA
Based on the end-use, the global Ball Grid Array (BGA) Packages market classified into
OEM
Aftermarket
Based on geography, the global Ball Grid Array (BGA) Packages market segmented into
North America [U.S., Canada, Mexico]
Europe [Germany, UK, France, Italy, Rest of Europe]
Asia-Pacific [China, India, Japan, South Korea, Southeast Asia, Australia, Rest of Asia Pacific]
South America [Brazil, Argentina, Rest of Latin America]
Middle East & Africa [GCC, North Africa, South Africa, Rest of Middle East and Africa]
And the major players included in the report are
Amkor Technology
TriQuint Semiconductor Inc.
Jiangsu Changjiang Electronics Technology Co.
STATS ChipPAC Ltd.
ASE Group
Advanced Semiconductor Engineering, Inc.
PARPRO
Intel
Corintech Ltd
Integrated Circuit Engineering Corporation
Further key aspects of the report indicate that:
Chapter 1: Research Scope: Product Definition, Type, End-Use & Methodology
Chapter 2: Global Industry Summary
Chapter 3: Market Dynamics
Chapter 4: Global Market Segmentation by region, type and End-Use
Chapter 5: North America Market Segmentation by region, type and End-Use
Chapter 6: Europe Market Segmentation by region, type and End-Use
Chapter 7: Asia-Pacific Market Segmentation by region, type and End-Use
Chapter 8: South America Market Segmentation by region, type and End-Use
Chapter 9: Middle East and Africa Market Segmentation by region, type and End-Use.
Chapter 10: Market Competition by Companies
Chapter 11: Market forecast and environment forecast.
Chapter 12: Industry Summary.
The global Ball Grid Array (BGA) Packages market has the potential to grow with xx million USD with growing CAGR in the forecast period from 2021f to 2026f. Factors driving the market for @@@@@ are the significant development of demand and improvement of COVID-19 and geo-economics.
Based on the type of product, the global Ball Grid Array (BGA) Packages market segmented into
Molded Array Process BGA
Thermally Enhanced BGA
Package on Package (PoP) BGA
Micro BGA
Based on the end-use, the global Ball Grid Array (BGA) Packages market classified into
OEM
Aftermarket
Based on geography, the global Ball Grid Array (BGA) Packages market segmented into
North America [U.S., Canada, Mexico]
Europe [Germany, UK, France, Italy, Rest of Europe]
Asia-Pacific [China, India, Japan, South Korea, Southeast Asia, Australia, Rest of Asia Pacific]
South America [Brazil, Argentina, Rest of Latin America]
Middle East & Africa [GCC, North Africa, South Africa, Rest of Middle East and Africa]
And the major players included in the report are
Amkor Technology
TriQuint Semiconductor Inc.
Jiangsu Changjiang Electronics Technology Co.
STATS ChipPAC Ltd.
ASE Group
Advanced Semiconductor Engineering, Inc.
PARPRO
Intel
Corintech Ltd
Integrated Circuit Engineering Corporation
Table of Contents
1 RESEARCH SCOPE
1.1 Research Product Definition
1.2 Research Segmentation
1.2.1 Product Type
1.2.2 Main product Type of Major Players
1.3 Demand Overview
1.4 Research Methodology
2 GLOBAL BALL GRID ARRAY (BGA) PACKAGES INDUSTRY
2.1 Summary about Ball Grid Array (BGA) Packages Industry
2.2 Ball Grid Array (BGA) Packages Market Trends
2.2.1 Ball Grid Array (BGA) Packages Production & Consumption Trends
2.2.2 Ball Grid Array (BGA) Packages Demand Structure Trends
2.3 Ball Grid Array (BGA) Packages Cost & Price
3 MARKET DYNAMICS
3.1 Manufacturing & Purchasing Behavior in 2020
3.2 Market Development under the Impact of COVID-19
3.2.1 Drivers
3.2.2 Restraints
3.2.3 Opportunity
3.2.4 Risk
4 GLOBAL MARKET SEGMENTATION
4.1 Region Segmentation (2017 to 2021f)
4.1.1 North America (U.S., Canada and Mexico)
4.1.2 Europe (Germany, UK, France, Italy, Rest of Europe)
4.1.3 Asia-Pacific (China, India, Japan, South Korea, Southeast Asia, Australia, Rest of Asia Pacific)
4.1.4 South America (Brazil,, Argentina, Rest of Latin America)
4.1.5 Middle East and Africa (GCC, North Africa, South Africa, Rest of Middle East and Africa)
4.2 Product Type Segmentation (2017 to 2021f)
4.2.1 Molded Array Process BGA
4.2.2 Thermally Enhanced BGA
4.2.3 Package on Package (PoP) BGA
4.2.4 Micro BGA
4.3 Consumption Segmentation (2017 to 2021f)
4.3.1 OEM
4.3.2 Aftermarket
5 NORTH AMERICA MARKET SEGMENT
5.1 Region Segmentation (2017 to 2021f)
5.1.1 U.S.
5.1.2 Canada
5.1.3 Mexico
5.2 Product Type Segmentation (2017 to 2021f)
5.2.1 Molded Array Process BGA
5.2.2 Thermally Enhanced BGA
5.2.3 Package on Package (PoP) BGA
5.2.4 Micro BGA
5.3 Consumption Segmentation (2017 to 2021f)
5.3.1 OEM
5.3.2 Aftermarket
5.4 Impact of COVID-19 in North America
6 EUROPE MARKET SEGMENTATION
6.1 Region Segmentation (2017 to 2021f)
6.1.1 Germany
6.1.2 UK
6.1.3 France
6.1.4 Italy
6.1.5 Rest of Europe
6.2 Product Type Segmentation (2017 to 2021f)
6.2.1 Molded Array Process BGA
6.2.2 Thermally Enhanced BGA
6.2.3 Package on Package (PoP) BGA
6.2.4 Micro BGA
6.3 Consumption Segmentation (2017 to 2021f)
6.3.1 OEM
6.3.2 Aftermarket
6.4 Impact of COVID-19 in Europe
7 ASIA-PACIFIC MARKET SEGMENTATION
7.1 Region Segmentation (2017 to 2021f)
7.1.1 China
7.1.2 India
7.1.3 Japan
7.1.4 South Korea
7.1.5 Southeast Asia
7.1.6 Australia
7.1.7 Rest of Asia Pacific
7.2 Product Type Segmentation (2017 to 2021f)
7.2.1 Molded Array Process BGA
7.2.2 Thermally Enhanced BGA
7.2.3 Package on Package (PoP) BGA
7.2.4 Micro BGA
7.3 Consumption Segmentation (2017 to 2021f)
7.3.1 OEM
7.3.2 Aftermarket
7.4 Impact of COVID-19 in Europe
8 SOUTH AMERICA MARKET SEGMENTATION
8.1 Region Segmentation (2017 to 2021f)
8.1.1 Brazil
8.1.2 Argentina
8.1.3 Rest of Latin America
8.2 Product Type Segmentation (2017 to 2021f)
8.2.1 Molded Array Process BGA
8.2.2 Thermally Enhanced BGA
8.2.3 Package on Package (PoP) BGA
8.2.4 Micro BGA
8.3 Consumption Segmentation (2017 to 2021f)
8.3.1 OEM
8.3.2 Aftermarket
8.4 Impact of COVID-19 in Europe
9 MIDDLE EAST AND AFRICA MARKET SEGMENTATION
9.1 Region Segmentation (2017 to 2021f)
9.1.1 GCC
9.1.2 North Africa
9.1.3 South Africa
9.1.4 Rest of Middle East and Africa
9.2 Product Type Segmentation (2017 to 2021f)
9.2.1 Molded Array Process BGA
9.2.2 Thermally Enhanced BGA
9.2.3 Package on Package (PoP) BGA
9.2.4 Micro BGA
9.3 Consumption Segmentation (2017 to 2021f)
9.3.1 OEM
9.3.2 Aftermarket
9.4 Impact of COVID-19 in Europe
10 COMPETITION OF MAJOR PLAYERS
10.1 Brief Introduction of Major Players
10.1.1 Amkor Technology
10.1.2 TriQuint Semiconductor Inc.
10.1.3 Jiangsu Changjiang Electronics Technology Co.
10.1.4 STATS ChipPAC Ltd.
10.1.5 ASE Group
10.1.6 Advanced Semiconductor Engineering, Inc.
10.1.7 PARPRO
10.1.8 Intel
10.1.9 Corintech Ltd
10.1.10 Integrated Circuit Engineering Corporation
10.2 Ball Grid Array (BGA) Packages Sales Date of Major Players (2017-2020e)
10.2.1 Amkor Technology
10.2.2 TriQuint Semiconductor Inc.
10.2.3 Jiangsu Changjiang Electronics Technology Co.
10.2.4 STATS ChipPAC Ltd.
10.2.5 ASE Group
10.2.6 Advanced Semiconductor Engineering, Inc.
10.2.7 PARPRO
10.2.8 Intel
10.2.9 Corintech Ltd
10.2.10 Integrated Circuit Engineering Corporation
10.3 Market Distribution of Major Players
10.4 Global Competition Segmentation
11 MARKET FORECAST
11.1 Forecast by Region
11.2 Forecast by Demand
11.3 Environment Forecast
11.3.1 Impact of COVID-19
11.3.2 Geopolitics Overview
11.3.3 Economic Overview of Major Countries
12 REPORT SUMMARY STATEMENT
1 RESEARCH SCOPE
1.1 Research Product Definition
1.2 Research Segmentation
1.2.1 Product Type
1.2.2 Main product Type of Major Players
1.3 Demand Overview
1.4 Research Methodology
2 GLOBAL BALL GRID ARRAY (BGA) PACKAGES INDUSTRY
2.1 Summary about Ball Grid Array (BGA) Packages Industry
2.2 Ball Grid Array (BGA) Packages Market Trends
2.2.1 Ball Grid Array (BGA) Packages Production & Consumption Trends
2.2.2 Ball Grid Array (BGA) Packages Demand Structure Trends
2.3 Ball Grid Array (BGA) Packages Cost & Price
3 MARKET DYNAMICS
3.1 Manufacturing & Purchasing Behavior in 2020
3.2 Market Development under the Impact of COVID-19
3.2.1 Drivers
3.2.2 Restraints
3.2.3 Opportunity
3.2.4 Risk
4 GLOBAL MARKET SEGMENTATION
4.1 Region Segmentation (2017 to 2021f)
4.1.1 North America (U.S., Canada and Mexico)
4.1.2 Europe (Germany, UK, France, Italy, Rest of Europe)
4.1.3 Asia-Pacific (China, India, Japan, South Korea, Southeast Asia, Australia, Rest of Asia Pacific)
4.1.4 South America (Brazil,, Argentina, Rest of Latin America)
4.1.5 Middle East and Africa (GCC, North Africa, South Africa, Rest of Middle East and Africa)
4.2 Product Type Segmentation (2017 to 2021f)
4.2.1 Molded Array Process BGA
4.2.2 Thermally Enhanced BGA
4.2.3 Package on Package (PoP) BGA
4.2.4 Micro BGA
4.3 Consumption Segmentation (2017 to 2021f)
4.3.1 OEM
4.3.2 Aftermarket
5 NORTH AMERICA MARKET SEGMENT
5.1 Region Segmentation (2017 to 2021f)
5.1.1 U.S.
5.1.2 Canada
5.1.3 Mexico
5.2 Product Type Segmentation (2017 to 2021f)
5.2.1 Molded Array Process BGA
5.2.2 Thermally Enhanced BGA
5.2.3 Package on Package (PoP) BGA
5.2.4 Micro BGA
5.3 Consumption Segmentation (2017 to 2021f)
5.3.1 OEM
5.3.2 Aftermarket
5.4 Impact of COVID-19 in North America
6 EUROPE MARKET SEGMENTATION
6.1 Region Segmentation (2017 to 2021f)
6.1.1 Germany
6.1.2 UK
6.1.3 France
6.1.4 Italy
6.1.5 Rest of Europe
6.2 Product Type Segmentation (2017 to 2021f)
6.2.1 Molded Array Process BGA
6.2.2 Thermally Enhanced BGA
6.2.3 Package on Package (PoP) BGA
6.2.4 Micro BGA
6.3 Consumption Segmentation (2017 to 2021f)
6.3.1 OEM
6.3.2 Aftermarket
6.4 Impact of COVID-19 in Europe
7 ASIA-PACIFIC MARKET SEGMENTATION
7.1 Region Segmentation (2017 to 2021f)
7.1.1 China
7.1.2 India
7.1.3 Japan
7.1.4 South Korea
7.1.5 Southeast Asia
7.1.6 Australia
7.1.7 Rest of Asia Pacific
7.2 Product Type Segmentation (2017 to 2021f)
7.2.1 Molded Array Process BGA
7.2.2 Thermally Enhanced BGA
7.2.3 Package on Package (PoP) BGA
7.2.4 Micro BGA
7.3 Consumption Segmentation (2017 to 2021f)
7.3.1 OEM
7.3.2 Aftermarket
7.4 Impact of COVID-19 in Europe
8 SOUTH AMERICA MARKET SEGMENTATION
8.1 Region Segmentation (2017 to 2021f)
8.1.1 Brazil
8.1.2 Argentina
8.1.3 Rest of Latin America
8.2 Product Type Segmentation (2017 to 2021f)
8.2.1 Molded Array Process BGA
8.2.2 Thermally Enhanced BGA
8.2.3 Package on Package (PoP) BGA
8.2.4 Micro BGA
8.3 Consumption Segmentation (2017 to 2021f)
8.3.1 OEM
8.3.2 Aftermarket
8.4 Impact of COVID-19 in Europe
9 MIDDLE EAST AND AFRICA MARKET SEGMENTATION
9.1 Region Segmentation (2017 to 2021f)
9.1.1 GCC
9.1.2 North Africa
9.1.3 South Africa
9.1.4 Rest of Middle East and Africa
9.2 Product Type Segmentation (2017 to 2021f)
9.2.1 Molded Array Process BGA
9.2.2 Thermally Enhanced BGA
9.2.3 Package on Package (PoP) BGA
9.2.4 Micro BGA
9.3 Consumption Segmentation (2017 to 2021f)
9.3.1 OEM
9.3.2 Aftermarket
9.4 Impact of COVID-19 in Europe
10 COMPETITION OF MAJOR PLAYERS
10.1 Brief Introduction of Major Players
10.1.1 Amkor Technology
10.1.2 TriQuint Semiconductor Inc.
10.1.3 Jiangsu Changjiang Electronics Technology Co.
10.1.4 STATS ChipPAC Ltd.
10.1.5 ASE Group
10.1.6 Advanced Semiconductor Engineering, Inc.
10.1.7 PARPRO
10.1.8 Intel
10.1.9 Corintech Ltd
10.1.10 Integrated Circuit Engineering Corporation
10.2 Ball Grid Array (BGA) Packages Sales Date of Major Players (2017-2020e)
10.2.1 Amkor Technology
10.2.2 TriQuint Semiconductor Inc.
10.2.3 Jiangsu Changjiang Electronics Technology Co.
10.2.4 STATS ChipPAC Ltd.
10.2.5 ASE Group
10.2.6 Advanced Semiconductor Engineering, Inc.
10.2.7 PARPRO
10.2.8 Intel
10.2.9 Corintech Ltd
10.2.10 Integrated Circuit Engineering Corporation
10.3 Market Distribution of Major Players
10.4 Global Competition Segmentation
11 MARKET FORECAST
11.1 Forecast by Region
11.2 Forecast by Demand
11.3 Environment Forecast
11.3.1 Impact of COVID-19
11.3.2 Geopolitics Overview
11.3.3 Economic Overview of Major Countries
12 REPORT SUMMARY STATEMENT
